Shenmao PF606-P26-T4J Type 4 SAC305 Sn/Ag3.0/Cu0.5 Lead-Free Halogen-Free Solder Paste 500 gram Jar.
Features:
Technical Data:
PF606-P26 |
|
Alloy | Sn/Ag3/Cu0.5/x |
Melting Point (C) | 217~219 |
Particle Size (μm) |
20-45 20-38 15-25 5~15 |
Flux Content (%) | 12±1 |
Flux Type | ROL0 |
Viscosity (Pa⋅s) | 200±30 |
Some products sold through this website can expose you to chemicals including diisononyl Phthalate (DINP), which is known to the State of California to cause cancer (www.P65warnings.ca.gov).
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