Shenmao SH6309RMA-T4J Type 4 Sn63/Pb37 No-Clean Solder Paste 500 gram Jar.
Features:
Technical Data:
SH6309RMA |
|
Alloy | Sn63/Pb37 |
Melting Point (C) | 183 |
Particle Size (μm) |
20-45 20-38 |
Flux Content (%) | 10±1 |
Flux Type | ROL1 |
Viscosity (Pa⋅s) | 200±30 |
Some products sold through this website can expose you to chemicals including diisononyl Phthalate (DINP), which is known to the State of California to cause cancer (www.P65warnings.ca.gov).
Practical Tools?
Thanks! You have been subscribed to our newsletter.
Please enter your email address.